Chemical Solutions for Chemical Mechanical Planarization (CMP)

Chemical Mechanical Planarization (CMP) is considered to be a key performance driver for advanced integrated circuits (IC) fabrication. Customized slurries and post-CMP cleaning solutions are critical for achieving optimal performance and yield. With our broad-based expertise in chemistry and in semiconductor surface conditioning, we have developed a whole host of innovative approaches that will deliver both performance and most crucially, reliability in future application nodes.

Creating Synergies

We collaborate with customers and research institutes to develop cooperation at all levels for CMP applications. These joint development projects brings customized solutions for our customers

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  • PLANAPUR ® S Series for Oxide CMP
  • PLANAPUR ® C Series for Copper CMP
  • PLANAPUR ® T Series for Barrier CMP

The Products and Services that You can Trust

BASF's unsurpassed reputation for reliability are not just for the excellent performance of products but also for the peace of mind that comes with customer service. Our CMP products are stable and easy to use. Best of all, our local and international field application service teams help our customers to qualify our products to existing production lines.