Chemical Solutions for Chemical Mechanical Planarization (CMP)

Chemical Mechanical Planarization (CMP) is considered to be a key performance driver for advanced integrated circuits (IC) fabrication. Customized slurries and post-CMP cleaning solutions are critical for achieving optimal performance and yield. With our broad-based expertise in chemistry and in semiconductor surface conditioning, we have developed a whole host of innovative approaches that will deliver both performance and most crucially, reliability in future application nodes.

Creating Synergies

We collaborate with customers and research institutes to develop cooperation at all levels for CMP applications. These joint development projects brings customized solutions for our customers

wafer_170x170 (1).jpg