SELECTIPUR® Series - Our Highly Reliable Etching Products
The efficient wet etching process relies heavily on chemicals with precise recipe control. With SELECTIPUR®, we provide customized solutions that are used for a whole host of different applications in IC manufacturing, including bumping and 3D TSV application.
- - SiO2/BOE/BHF Etch Series
- - SiO2 thin film removal before metallization by NH4F based recipes e.g., Q-Etch and Fence Etch
- - Silicon & Poly Silicon Etch Series
- - Si3N4 Etch Series
- - TiN Etch Series
- - Spin Etch Series- specific recipes for wafer thinning and roughening, stress relief, damage removal, poly-silicon etching
- - Al Etch Series
- - Cu Etch Series
- - Ni Etch Series
- - Ti Etch Series
- - Stack Etch Series: etching of metal layer stacks
BASF’s product portfolio for etching applications also comprises a set of single chemicals: H2SO4, H3PO4, HNO3, HCl, NH4F and HF. All product lines are available in different purity levels.