Copper Technology: The Future Wave

The move from aluminum to copper processes creates new challenges for materials and chemicals. BASF was one of the first to develop chemical solutions for this generational change and is an acknowledged leader in copper technology. We can help our customers meet the enhanced requirements of copper applications and migrate to this exciting new technology. We have worked with some of the leading panel makers in the world to be the first supplier in Taiwan to provide innovative copper solutions for this emerging technology.

Advantages of BASF's Cu Products

SELECTIPUR^® Cu Etchants

Superior critical dimension (CD) loss
Outstanding tapered angles
Optimal Cu/Mo etching selectivity
Customization
Extended lifetime

FOTOPUR^® Cu Strippers

Excellent photoresist removal ability
First-rate removal ability for surface copper oxide
Extended lifetime
Recyclable

SELECTIPUR^®

Etchants:

BOE Series
Ag Etch Series
Al Etch Series
Mo Etch Series
Cr Etch Series
Cu/Mo Etch Series
ITO Etch Series
Mo Etch Series
Ti/Al Etch Series
Glass thinner Series
Ni Etch Series

Detergents:

Substrate Cleaning SeriesOrganic Residue Cleaning SeriesLiquid Crystal Cleaning SeriesMask Cleaning Series

FOTOPUR^®

Strippers:

Color Filter Rework Series
Water Based Series
Cu Technology Series
LCD Array Process Series
PI Rework Series

Thinners:

Color Filter Application Series

Developers:

Array Developer SeriesColor Filter Developing Series